IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Novel Resistance Measurement Methodology for $In~Situ$ UBM/Solder Interfacial Reaction Monitoring

Author(s): Lin Hou ; Jaber Derakhshandeh ; Eric Beyne ; Ingrid De Wolf
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 10
Page(s): 30 - 38
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2950448
Regular:

This article presents a methodology to investigate, in situ, the interfacial solid-state reaction of alternative metallurgical systems, such as Cu/Ni/Sn and Ni/Cu/Sn bumps. The methodology is... View More

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