IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Theoretical Solution for Thermal Warpage of Flip-Chip Packages

Author(s): Ming-Yi Tsai ; Yu-Wen Wang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 10
Page(s): 72 - 78
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2933546
Regular:

The control of thermally induced warpage on electronic packages is an important issue during their fabrication process and assembly. Apart from a commonly used finite-element method and... View More

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