IEEE - Institute of Electrical and Electronics Engineers, Inc. - Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn–Ag–Cu Solder Balls

Author(s): Maik Mueller ; Iuliana Panchenko ; Steffen Wiese ; Klaus-Jurgen Wolter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 10
Page(s): 18 - 29
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2952093
Regular:

This article focuses on the morphologies of primary Cu6Sn5 and Ag3Sn intermetallics in small Sn-Ag-Cu (Ø 270 μm) solder balls. The... View More

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