IEEE - Institute of Electrical and Electronics Engineers, Inc. - Chip-Package-Board Reliability of System-in-Package Using Laminate Chip Embedding Technology Based on Cu Leadframe

Author(s): Peter Fruehauf ; Andreas Munding ; Klaus Pressel ; Patrick Schwarz ; Michael Vogt
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 10
Page(s): 44 - 56
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2955822
Regular:

We investigate the reliability of a system-in-package (SiP) technology, which uses laminate chip embedding based on a copper leadframe. For this SiP technology, we apply different Si-based... View More

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