IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel Pre-Applied Underfill Material Designed for Collective Bonding Process

Author(s): Masashi Okaniwa ; Kohei Higashiguchi ; Takahito Sekido ; Katsutoshi Ihara ; Tsuyoshi Kida ; Shu Yoshida
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 10
Page(s): 11 - 17
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2950697
Regular:

Internet of Things (IoT) accelerated by the rapid progress of 5G is bringing a lot of challenges to semiconductor packaging technologies. In particular, flip-chip bonding technology is strongly... View More

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