IEEE - Institute of Electrical and Electronics Engineers, Inc. - Via-Monopole Based Quasi Yagi-Uda Antenna for W-Band Applications using Through Glass Silicon via (TGSV) Technology

Author(s): Aqeel Hussain Naqvi ; Jeong-Heum Park ; Chang-Wook Baek ; Sungjoon Lim
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 8
Page(s): 9,513 - 9,519
ISSN (Electronic): 2169-3536
DOI: 10.1109/ACCESS.2020.2964709
Regular:

This paper presents a W-band planar type via-monopole based quasi Yagi-Uda antenna using metal coated through glass silicon via structures. The antenna was designed and fabricated on 350 μm... View More

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