IEEE - Institute of Electrical and Electronics Engineers, Inc. - Immunity Enhancement of the Power Distribution Network in Integrated Circuits With Coplanar Meander Lines in Package

Author(s): Bo Pu ; Jun Fan ; Wansoo Nah
Sponsor(s): IEEE Electromagnetic Compatibility Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1 - 9
ISSN (Electronic): 1558-187X
ISSN (Paper): 0018-9375
DOI: 10.1109/TEMC.2019.2962096
Regular:

Integrated circuits suffer from interference in frequency multibands in real scenarios, and this susceptibility allows them to easily malfunction. In this article, a novel miniature coplanar... View More

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