IEEE - Institute of Electrical and Electronics Engineers, Inc. - Facile Four-Mask Processes for Organic Thin-Film Transistor Integration Structure with Metal Interconnect

Author(s): Min Li ; Zhe Liu ; Linrun Feng ; Jiali Fan ; Lei Han ; Simon Ogier ; Hang Zhou ; Xiaojun Guo
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 1558-0563
ISSN (Paper): 0741-3106
DOI: 10.1109/LED.2019.2957007
Regular:

To enable an organic thin film transistor (OTFT) technology for circuit integration, the passivation layer and subsequent interconnect metallization on top of the OTFT is vital. In this work, a... View More

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