IEEE - Institute of Electrical and Electronics Engineers, Inc. - Sub-notebook computer cooling technology via hybrid housings

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Author(s): Kimura, K. ; Nishi, K. ; Ishizuka, M. ; Miyahara, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Seattle, WA, USA, USA
Conference Date: 27 May 1998
Page(s): 35 - 42
ISBN (Paper): 0-7803-4475-8
ISSN (Paper): 1089-9870
DOI: 10.1109/ITHERM.1998.689517
Regular:

Until now, over 90% of notebook PC housings have been made of resin. Resin has inherently poor heat dissipation characteristics due to its low thermal conductivity. Although metal housings made of... View More

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