IEEE - Institute of Electrical and Electronics Engineers, Inc. - Micromachining for Advanced Terahertz: Interconnects and Packaging Techniques at Terahertz Frequencies

Author(s): Maria Alonso-del Pino ; Cecile Jung-Kubiak ; Theodore Reck ; Choonsup Lee ; Goutam Chattopadhyay
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 21
Page(s): 18 - 34
ISSN (Electronic): 1557-9581
ISSN (Paper): 1527-3342
DOI: 10.1109/MMM.2019.2945157
Regular:

It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem... View More

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