IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of the backside loading inductive tactile force sensor using the flip-chip bonding of CMOS sensing chip

Author(s): Sheng-Kai Yeh ; Jiunn-Horng Lee ; Weileun Fang
Sponsor(s): IEEE Sensors Council
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (CD): 2379-9153
ISSN (Electronic): 1558-1748
ISSN (Paper): 1530-437X
DOI: 10.1109/JSEN.2019.2955149
Regular:

This study presents a backside loading design inductive tactile sensor with the monolithic integration of thermometer. Based on the commercially available standard complementary... View More

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