IEEE - Institute of Electrical and Electronics Engineers, Inc. - On Runtime Communication and Thermal-Aware Application Mapping and Defragmentation in 3D NoC Systems

Author(s): Bing Li ; Xiaohang Wang ; Amit Kumar Singh ; Terrence Mak
Sponsor(s): IEEE Computer Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2019
Volume: 30
Page(s): 2,775 - 2,789
ISSN (CD): 2161-9883
ISSN (Electronic): 1558-2183
ISSN (Paper): 1045-9219
DOI: 10.1109/TPDS.2019.2921542
Regular:

Many-core systems connected by 3D Networks-on-Chip (NoC) are emerging as a promising computation engine for systems like cloud computing servers, big data systems, etc. Mapping applications at... View More

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