IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3-D Chips! Chips are Getting Denser and Taller Than Ever!!

Author(s): Lizy Kurian John
Sponsor(s): IEEE Computer Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2019
Volume: 39
Page(s): 4 - 5
ISSN (Electronic): 1937-4143
ISSN (Paper): 0272-1732
DOI: 10.1109/MM.2019.2948453
Regular:

Presents the introductory editorial for this issue of the publication.

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