IEEE - Institute of Electrical and Electronics Engineers, Inc. - Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls

Author(s): Libo Zhao ; Zhenzhi He ; Zengxiang Wang ; Lei Su ; Xiangning Lu
Sponsor(s): IEEE Industrial Electronics Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 1941-0050
ISSN (Paper): 1551-3203
DOI: 10.1109/TII.2019.2945583
Regular:

The miniaturized electronic products require not only high density but also high reliability. Defect inspection for the high-density package becomes challenging gradually. Active thermography... View More

Advertisement