IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits (FPCs) using Sn52In Solder Anisotropic Conductive Films (ACFs) for Flexible Ultrasonic Transducers

Author(s): Jae-Hyeong Park ; Jong Cheol Park ; SangMyung Shin ; Kyung-Wook Paik
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2945016
Regular:

Solder ACFs are consisted of conductive solder particles, polymer resin, and flux activator. The flux activator removes solder oxide of solder particles by generated acid for the solder wetting... View More

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