IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization of Electroless Nickel Plated Materials During High Temperature Solder Processing

Author(s): David M. Rhodes ; Saurabh D. Chowdhury ; Sung Yea ; Jose Guerrero ; Nicholas Bushnell
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 1558-2345
ISSN (Paper): 0894-6507
DOI: 10.1109/TSM.2019.2945517
Regular:

Electroless nickel immersion gold (ENIG) has emerged as a leading surface finish for under bump metallization (UBM). An ENIG surface typically exhibits excellent planarity, good electrical... View More

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