IEEE - Institute of Electrical and Electronics Engineers, Inc. - MIM Surface Reconditioning under Knudsen Flow during Metal Deposition Process

Author(s): Changre Weng ; Jinhong Yang ; Tertius Rivers ; Mark Tesauro
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 1558-2345
ISSN (Paper): 0894-6507
DOI: 10.1109/TSM.2019.2944780
Regular:

Failure analysis revealed that capacitor shortcircuit failures were related to a MIM metal missing/peeling defect. During subsequent investigation a correlation between MIM top metal defects and... View More

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