IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis of the Grounding Resistance of a Hemispheric Electrode Located on a Truncated Cone

Author(s): K. B. Tan ; H. M. Lu ; Y. Zhang ; W. C. Zuo
Sponsor(s): IEEE Electromagnetic Compatibility Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1 - 3
ISSN (Electronic): 1558-187X
ISSN (Paper): 0018-9375
DOI: 10.1109/TEMC.2019.2940902
Regular:

An analytical solution is derived to analyze the grounding properties of electrodes located on the top of a mountain with a realistic grounding structure. By using the derived close-form solution,... View More

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