IEEE - Institute of Electrical and Electronics Engineers, Inc. - A High Performance Embedded SiC Power Module Based on a DBC-Stacked Hybrid Packaging Structure

Author(s): Zhizhao Huang ; Cai Chen ; Yue Xie ; Yiyang Yan ; Yong Kang ; Fang Luo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2168-6785
ISSN (Paper): 2168-6777
DOI: 10.1109/JESTPE.2019.2943635
Regular:

Silicon carbide (SiC) devices have the advantage of high switching speed. However, the switching speed is limited by the high parasitic inductance which could cause high voltage overshoot,... View More

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