IEEE - Institute of Electrical and Electronics Engineers, Inc. - Power Profiling of Modern Die-Stacked Memory

Author(s): Dylan Stow ; Amin Farmahini-Farahani ; Sudhanva Gurumurthi ; Michael Ignatowski ; Yuan Xie
Sponsor(s): IEEE Computer Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (CD): 2473-2575
ISSN (Electronic): 1556-6064
ISSN (Paper): 1556-6056
DOI: 10.1109/LCA.2019.2941715
Regular:

Die-stacked memories that integrate multiple DRAM dies into the processor package have reduced the interface bottleneck and improved efficiency, but demands for memory capacity and bandwidth... View More

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