IEEE - Institute of Electrical and Electronics Engineers, Inc. - Innovative Sub-5 Micron Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects

Author(s): Fuhan Liu ; Gaurav Khurana ; Rui Zhang ; Atom Watanabe ; Bartlet H. DeProspo ; Chandrasekharan Nair ; Rao R. Tummala ; Madhavan Swaminathan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2941866
Regular:

This paper presents for the first time microvias scaled down to sub-5 μm in diameter fabricated using picosecond UV laser ablation in a non-photoimageable dielectric film. The motivation of... View More

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