IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling and Controlling Layout Dependent Variations in Semi-Additive Copper Electrochemical Plating

Author(s): Christopher I. Lang ; Duane S. Boning
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 1558-2345
ISSN (Paper): 0894-6507
DOI: 10.1109/TSM.2019.2941439
Regular:

An empirical model is proposed for predicting layout dependent thickness variations in the semi-additive copper electrochemical plating (ECP) process. These variations are believed to be caused by... View More

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