IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Novel DBSCAN-Based Defect Pattern Detection and Classification Framework for Wafer Bin Map

Author(s): Cheng Hao Jin ; Hyuk Jun Na ; Minghao Piao ; Gouchol Pok ; Keun Ho Ryu
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2019
Volume: 32
Page(s): 286 - 292
ISSN (Electronic): 1558-2345
ISSN (Paper): 0894-6507
DOI: 10.1109/TSM.2019.2916835
Regular:

Defective die on a wafer map tend to cluster in distinguishable patterns, and such defect patterns can provide crucial information to identify equipment problems or process failures in the... View More

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