IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microstructure Evolution Mechanism and Fracture Characteristic of Bimodal Size SiCp/Mg Composite

Author(s): Mingjie Shen ; Jiahong Jia
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2019
Volume: 7
Page(s): 85,604 - 85,612
ISSN (Electronic): 2169-3536
DOI: 10.1109/ACCESS.2019.2925842
Regular:

In this paper, as-extruded ( $\sim \!\!1\mu \text{m}\,\,+\!\sim \!\!60$ nm) bimodal size SiC particle (SiCp) reinforced magnesium matrix composite was subjected to step-by-step tensile... View More

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