IEEE - Institute of Electrical and Electronics Engineers, Inc. - A 3D rotation based Through-Silicon Via Redundancy Architecture for Clustering Faults

Author(s): Minho Cheong ; Ingeol Lee ; Sungho Kang
Sponsor(s): IEEE Council on Electronic Design Automation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 1937-4151
ISSN (Paper): 0278-0070
DOI: 10.1109/TCAD.2019.2927485
Regular:

Three-dimensional integrated circuits (3D ICs), which feature many benefits such as high bandwidth and a high degree of integration, have recently received considerable attention from the... View More

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