IEEE - Institute of Electrical and Electronics Engineers, Inc. - SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating

Author(s): K. Lomakin ; S. Herold ; L. Ringel ; J. Ringela ; D. Simon ; M. Sippel ; A. Sion ; M. Vossiek ; K. Helmreich ; G. Gold
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2927671
Regular:

This work proposes a fabrication approach for 3D printed waveguide paths based on a combination of an optimized electroless silver plating process with a waveguide-specific design rule for general... View More

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