IEEE - Institute of Electrical and Electronics Engineers, Inc. - A New Vibration Device applied for Two-Dimensional Ultrasonic Polishing of Biomaterials

Author(s): Jieqiong Lin ; Hao Lu ; Yan Gu ; Xiaoqin Zhou ; Chenglei Xin ; Mingshuo Kang ; Xinyu Cang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2169-3536
DOI: 10.1109/ACCESS.2019.2927615
Regular:

For the research of performance of two-dimensional ultrasonic polishing (TDUP) on the biomaterials, a new vibration device was designed. Meanwhile, our aim is to study the mechanism of multiangle... View More

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