IEEE - Institute of Electrical and Electronics Engineers, Inc. - Active Silicon Interposer for Heterogeneous Integration: System Scaling and Cost Effectiveness

2019 Electron Devices Technology and Manufacturing Conference (EDTM)

Author(s): Vivek Chidambaram ; Jayabalan Jayasanker ; Sharon Lim Pei Siang ; Wang Xiang Yu ; V. N. Sekhar ; Surya Bhattacharya
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2019
Conference Location: Singapore, Singapore, Singapore
Conference Date: 12 March 2019
Page(s): 339 - 341
ISBN (Electronic): 978-1-5386-6508-4
DOI: 10.1109/EDTM.2019.8731309
Regular:

Achieved system scaling by implementing key system functions into active interposer. Demonstrated partitioning of System on Chip (SoC) to smaller dies to achieve lower cost and higher yield.... View More

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