IEEE - Institute of Electrical and Electronics Engineers, Inc. - Micro-fabricated Surface Electrode Ion Trap with 3D-TSV Integration for Scalable Quantum Computing

2019 Electron Devices Technology and Manufacturing Conference (EDTM)

Author(s): Jing Tao ; Luca Guidoni ; Hong Yu Li ; Lin Bu ; Nam Piau Chew ; Chuan Seng Tan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2019
Conference Location: Singapore, Singapore, Singapore
Conference Date: 12 March 2019
Page(s): 300 - 302
ISBN (Electronic): 978-1-5386-6508-4
DOI: 10.1109/EDTM.2019.8731188
Regular:

In this paper, 3D architecture for TSV integrated Si surface ion-trap is proposed, in which the TSV and microbump technology is used to connect the surface electrodes of ion trap to a bottom Si... View More

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