IEEE - Institute of Electrical and Electronics Engineers, Inc. - The Scaling of Cu-Cu Hybrid Bonding For High Density 3D Chip Stacking

2019 Electron Devices Technology and Manufacturing Conference (EDTM)

Author(s): Y. Kagawa ; S. Hida ; Y. Kobayashi ; K. Takahashi ; S. Miyanomae ; M. Kawamura ; H. Kawashima ; H. Yamagishi ; T. Hirano ; K. Tatani ; H. Nakayama ; K. Ohno ; H. Iwamoto ; S. Kadomura
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2019
Conference Location: Singapore, Singapore, Singapore
Conference Date: 12 March 2019
Page(s): 297 - 299
ISBN (Electronic): 978-1-5386-6508-4
DOI: 10.1109/EDTM.2019.8731186
Regular:

We have successfully improved the scaling of Cu-Cu hybrid bonding. In this study, 3 $\mu {\mathrm{ m}}$-pitch and 3M Cu-Cu connections with sufficient electrical properties and reliabilities were... View More

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