IEEE - Institute of Electrical and Electronics Engineers, Inc. - Module/SiP Packaging Trends

2019 Electron Devices Technology and Manufacturing Conference (EDTM)

Author(s): Milind Shah ; Rajneesh Kumar ; Chin-Kwan Kim ; Manuel Aldrete ; Ahmer Syed ; Piyush Gupta ; Ryan Lane
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2019
Conference Location: Singapore, Singapore, Singapore
Conference Date: 12 March 2019
Page(s): 82 - 84
ISBN (Electronic): 978-1-5386-6508-4
DOI: 10.1109/EDTM.2019.8731206
Regular:

With the advent of 5G functionality in mobile devices the need for having more space for IC packaging inside these devices is becoming critical. Devices with 5G functionality would require many... View More

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