IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability Evaluation of Silicon Interconnect Fabric Technology

2019 IEEE International Reliability Physics Symposium (IRPS)

Author(s): Kannan K. Thankappan ; Adeel Bajwa ; Boris Vaisband ; SivaChandra Jangam ; Subramanian S. Iyer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2019
Conference Location: Monterey, CA, USA, USA
Conference Date: 31 March 2019
Page(s): 1 - 5
ISBN (Electronic): 978-1-5386-9504-3
ISSN (Electronic): 1938-1891
DOI: 10.1109/IRPS.2019.8720516
Regular:

In this paper, we examine the effect of electrostatic discharge (ESD)and thermal compression bonding on the integrity of dielet assembly on the silicon interconnect fabric (Si-IF)technology. Our... View More

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