IEEE - Institute of Electrical and Electronics Engineers, Inc. - CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate

2019 IEEE International Reliability Physics Symposium (IRPS)

Author(s): Zhuo-Jie Wu ; Manish Nayini ; Charles Carey ; Samantha Donovan ; David Questad ; Edmund Blackshear
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2019
Conference Location: Monterey, CA, USA, USA
Conference Date: 31 March 2019
Page(s): 1 - 7
ISBN (Electronic): 978-1-5386-9504-3
ISSN (Electronic): 1938-1891
DOI: 10.1109/IRPS.2019.8720530
Regular:

This paper reports a comprehensive CPI study of a large die in 5 different flip chip packaging configurations. Chip corner crack and delamination were observed in temperature cycling stresses.... View More

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