IEEE - Institute of Electrical and Electronics Engineers, Inc. - Alternating Temperature Stress and Deduction of Effective Stress Levels from Mission Profiles for Semiconductor Reliability

2019 IEEE International Reliability Physics Symposium (IRPS)

Author(s): A. Hirler ; A. Alsioufy ; J. Biba ; T. Lehndorff ; D. Lipp ; H. Lochner ; M. Siddabathula ; S. Simon ; T. Sulima ; M. Wiatr ; W. Hansch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2019
Conference Location: Monterey, CA, USA, USA
Conference Date: 31 March 2019
Page(s): 1 - 4
ISBN (Electronic): 978-1-5386-9504-3
ISSN (Electronic): 1938-1891
DOI: 10.1109/IRPS.2019.8720536
Regular:

Mission profiles and step-stress life tests are depending on cumulative damage models for reliability analysis. Although cumulative damage models exist, they are rarely verified on empirical data... View More

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