IEEE - Institute of Electrical and Electronics Engineers, Inc. - An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material with A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate

Author(s): Lei Guo ; Xinrong Zhang ; Chul-Hee Lee ; Ioan D. Marinescu ; Yihe Zhang ; Jizhuang Hui
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2169-3536
DOI: 10.1109/ACCESS.2019.2917304
Regular:

Sapphire is one of the most widely used electronic substrate materials in the industry. The manufacturing process of sapphire and such hard and brittle materials is extremely time and energy... View More

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