IEEE - Institute of Electrical and Electronics Engineers, Inc. - Tensile-Fatigue Behavior of Sintered Copper Die-Attach Material

Author(s): Tomohisa Suzuki ; Yusuke Yasuda ; Takeshi Terasaki ; Toshiaki Morita ; Yuki Kawana ; Dai Ishikawa ; Masato Nishimura ; Hideo Nakako ; Kazuhiko Kurafuchi ; Tetsuya Matsuda
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 1558-2574
ISSN (Paper): 1530-4388
DOI: 10.1109/TDMR.2019.2916784
Regular:

The tensile-fatigue behavior of sintered-copper die-attach materials was investigated by focusing on sintering-pressure dependence. Specimens for fatigue tests were prepared by sintering copper... View More

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