IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaluation of Stiffness-Reduced Joints by Transient Liquid-Phase Sintering of Copper-Solder-Resin Composite for SiC Die-Attach Applications

Author(s): Hiroaki Tatsumi ; Adrian Lis ; Hiroshi Yamaguchi ; Yoshihiro Kashiba ; Akio Hirose
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2916053
Regular:

Transient liquid-phase sintering (TLPS) using a Cu-solder-resin composite for the die-attach application of high-temperature silicon carbide (SiC) power modules was evaluated with the goal of... View More

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