IEEE - Institute of Electrical and Electronics Engineers, Inc. - Advanced FD-SOI and Beyond Low Temperature SmartCutTM Enables High Density 3D SoC Applications

Author(s): W. Schwarzenbach ; B.-Y. Nguyen ; L. Ecarnot ; S. Loubriat ; M. Detard ; E. Cela ; C. Bertrand-Giuliani ; G. Chabanne ; C. Maddalon ; N. Daval ; C. Maleville
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2168-6734
DOI: 10.1109/JEDS.2019.2916460
Regular:

Beyond 65FD-SOI, 28FD-SOI, 22FD-SOI production granted technologies, SmartCutTM development supports both Advanced FD-SOI and Low Temperature SOI roadmaps. Ultrathin SOI and BOX materials... View More

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