IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

Author(s): Mahdi Soltani ; Romit Kulkarni ; Tobias Scheinost ; Tobias Groezinger ; Andre Zimmermann
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2169-3536
DOI: 10.1109/ACCESS.2019.2913786
Regular:

Due to many advantages, such as cost-effective production, design freedom and weight reduction, plastics have replaced metals and ceramics in many fields. However, engineering plastics are good... View More

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