IEEE - Institute of Electrical and Electronics Engineers, Inc. - Monolithic Integration of Si-CMOS and III-V-on-Si Through Direct Wafer Bonding Process

Author(s): Kwang Hong Lee ; Yue Wang ; Bing Wang ; Li Zhang ; Wardhana Aji Sasangka ; Shuh Chin Goh ; Shuyu Bao ; Kenneth E. Lee ; Eugene A. Fitzgerald ; Chuan Seng Tan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2018
Volume: 6
Page(s): 571 - 578
ISSN (Electronic): 2168-6734
DOI: 10.1109/JEDS.2017.2787202
Regular:

Integration of silicon-complementary metal oxide-semiconductor (Si-CMOS) and III-V compound semiconductors (with device structures of either InGaAs HEMT, AlGaInP LED, GaN HEMT, or InGaN... View More

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