IEC - International Electrotechnical Commission - IEC 62148-21:2019
Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 11 March 2019 |
| Status: | revised |
| Page Count: | 25 |
| ICS Code (Fibre optic interconnecting devices): | 33.180.20 |
abstract:
IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land... View More
Document History
April 22, 2021
Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
IEC 62148-21:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to...
April 22, 2021
Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
IEC 62148-21:2021 is available as IEC 62148-21:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous...
IEC 62148-21:2019
March 11, 2019
Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid...