CES - An inverse kinematic analysis modeling on a 6-PSS compliant parallel platform for optoelectronic packaging

Author(s): Fulong Hou ; Meizhu Luo ; Zijiao Zhang
Publisher: CES
Publication Date: 1 March 2019
Volume: 3
Page(s): 81 - 87
ISSN (Paper): 2096-3564
DOI: 10.30941/CESTEMS.2019.00011
Regular:

Multiple degree of freedom motion platform is always one of the important components in optoelectronic packaging systems, its characteristics have a vital impact on the performances of... View More

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