IEEE - Institute of Electrical and Electronics Engineers, Inc. - Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs

Author(s): Sheriff Sadiqbatcha ; Zeyu Sun ; Sheldon X.-D. Tan
Sponsor(s): IEEE Council on Electronic Design Automation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 1937-4151
ISSN (Paper): 0278-0070
DOI: 10.1109/TCAD.2019.2907908
Regular:

For practical testing and detection of electromigration (EM) induced failures in dual damascene copper interconnects, one critical issue is creating stressing conditions to induce the chip to fail... View More

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