IEEE - Institute of Electrical and Electronics Engineers, Inc. - HFSS simulation of wireless inter-chip communication for 5G applications

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

Author(s): Yu-Hao Long ; Jhih YuYu ; Chung-Long Pan ; Yu-Jung Huang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2018
Conference Location: Clear Water Bay, Hong Kong, Hong Kong
Conference Date: 17 December 2018
Page(s): 1 - 2
ISBN (Electronic): 978-1-5386-5642-6
DOI: 10.1109/EMAP.2018.8660944
Regular:

The signal transmission effect of the three-dimensional stacked die with capacitive coupling interconnection is analyzed in this paper. The results of the HFSS simulation show that the... View More

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