IEEE - Institute of Electrical and Electronics Engineers, Inc. - Laser hybrid integration on silicon photonic integrated circuits with reflected grating

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

Author(s): Yu SUN ; Man ZHAO ; Juan WEI ; Fengman LIU ; Haiyun XUE ; Huimin HE ; Liqiang CAO
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2018
Conference Location: Singapore, Singapore, Singapore
Conference Date: 4 December 2018
Page(s): 798 - 801
ISBN (Electronic): 978-1-5386-7668-4
ISBN (USB): 978-1-5386-7667-7
DOI: 10.1109/EPTC.2018.8654416
Regular:

For high-density, broadband, and low power consumption interconnect, the flip-chip silicon photonic integrated circuits (PIC) is a promising package structure which makes the signal path shorter,... View More

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