IEEE - Institute of Electrical and Electronics Engineers, Inc. - SIPI Co-Sim: Signal Performance of Super Speed Differential I/O with Power Referencing Design

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

Author(s): Li Wern Chew ; Paik Wen Ong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2018
Conference Location: Singapore, Singapore, Singapore
Conference Date: 4 December 2018
Page(s): 158 - 161
ISBN (Electronic): 978-1-5386-7668-4
ISBN (USB): 978-1-5386-7667-7
DOI: 10.1109/EPTC.2018.8654326
Regular:

Printed circuit board (PCB) design with full ground referencing for high speed signaling is generally preferred for better or cleaner signal return path. However, this has become very challenging... View More

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