IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design and Optimization of Inductive-Coupling Links for 3-D-ICs

Author(s): Benjamin J. Fletcher ; Shidhartha Das ; Terrence Mak
Sponsor(s): IEEE Computer Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2019
Volume: 27
Page(s): 711 - 723
ISSN (Electronic): 1557-9999
ISSN (Paper): 1063-8210
DOI: 10.1109/TVLSI.2018.2881075
Regular:

Recent research in the field of 3-D system integration has looked to the use of inductive-coupling links (ICLs) to provide vertical connectivity without incurring the inflated fabrication and... View More

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