IEC - International Electrotechnical Commission - IEC 63068-2:2019
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 30 January 2019 |
| Status: | published |
| Page Count: | 25 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 63068-2:2019(E) provides definitions and guidance in use of optical inspection for detecting as-grown defects in commercially available 4H-SiC (Silicon Carbide) epitaxial wafers. Additionally,... View More
Document History
IEC 63068-2:2019
January 30, 2019
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
IEC 63068-2:2019(E) provides definitions and guidance in use of optical inspection for detecting as-grown defects in commercially available 4H-SiC (Silicon Carbide) epitaxial wafers. Additionally,...