IEEE - Institute of Electrical and Electronics Engineers, Inc. - A PVT-Resilient No-Touch DFT Methodology for Prebond TSV Testing

2018 IEEE International Test Conference (ITC)

Author(s): Sourav Das ; Fei Su ; Sreejit Chakravarty
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2018
Conference Location: Phoenix, AZ, USA, USA
Conference Date: 29 October 2018
Page(s): 1 - 10
ISBN (Electronic): 978-1-5386-8382-8
ISSN (Electronic): 2378-2250
DOI: 10.1109/TEST.2018.8624691
Regular:

Prebond TSV testing is a powerful technique to identify faulty TSVs prior to 3-D stacking and to boost up the chip yield rate significantly. Existing prebond test methodologies experience fault... View More

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