IEEE - Institute of Electrical and Electronics Engineers, Inc. - Extracting Radio Frequency Properties of a Typical Through Silicon Via Structure with a Self-Developed De-Embedding Technique

Author(s): Kun-Fu Tseng ; Tzu-Yen Huang ; Ben-Je Lwo ; Tom Ni
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2018.2890009
Regular:

The parasitic effect inside through silicon via (TSV) packaging under radio-frequency (RF) operation may cause abnormal signals in circuit performance. On the bases of a self-developed... View More

Advertisement